| Cert Code | Cert Status | Survey Date | Review Date | Exp Date | Description |
|---|---|---|---|---|---|
| C05 | Approved | 09/23/2008 | 09/23/2010 | 09/23/2010 | MIL-C-5541D - ALUMINUM CHEMICAL FILM - CLASS 1A |
| C06 | Approved | 09/23/2008 | 09/23/2010 | 09/23/2010 | MIL-C-5541D - ALUMINUM CHEMICAL FILM - CLASS 3 |
| C65 | Approved | 09/23/2008 | 09/23/2010 | 09/23/2010 | AMS QQ-P-35/QQ-P-35 PASS OF STAINLESS ST TYPE II |
| C66 | Approved | 09/23/2008 | 09/23/2010 | 09/23/2010 | AMS QQ-P-35/QQ-P-35 PASS OF STAINLESS ST TYPE VI |
| C69 | Approved | 09/23/2008 | 09/23/2010 | 09/23/2010 | AMS/MIL-C-5541E ALUMINUM CHEMICAL FILM CLASS 1A |
| C70 | Approved | 09/23/2008 | 09/23/2010 | 09/23/2010 | AMS/MIL-C-5541E ALUMINUM CHEMICAL FILM CLASS 3 |
| C91 | Approved | 09/23/2008 | 09/23/2010 | 09/23/2010 | MIL-C-5541 - ALUMINUM CHEMICAL FILM |
| H04 | Approved | 05/23/2008 | 05/23/2010 | 05/23/2010 | MIL-H-7199 - HEAT TREATMENT OF COPPER BERYLLIUM ALLOYS |
| H23 | Approved | 05/23/2008 | 05/23/2010 | 05/23/2010 | MIL-H-7199 - STRESS RELIEF OF COPPER BERYLLIUM ALLOYS |
| P08 | Approved | 09/23/2008 | 09/23/2010 | 09/23/2010 | MIL-T-10727 TYPE I/ASTM B545 TIN ELECTROPLATING |
| P12 | Approved | 09/23/2008 | 09/23/2010 | 09/23/2010 | AMS/MIL-P-81728 TIN ALLOY ELECTROPLATING |
| P19 | Approved | 09/23/2008 | 09/23/2010 | 09/23/2010 | AMS/MIL-C-26074 ELECTROLESS NICKEL PLATING CLASS 1 |
| P1W | Approved | 09/23/2008 | 09/23/2010 | 09/23/2010 | MIL-G-45204 GOLD ELECTROPLATING TYPE II GRADE A |
| P20 | Approved | 09/23/2008 | 09/23/2010 | 09/23/2010 | AMS/MIL-C-26074 ELECTROLESS NICKEL PLATING CLASS 2 |
| P21 | Approved | 09/23/2008 | 09/23/2010 | 09/23/2010 | AMS/MIL-C-26074 ELECTROLESS NICKEL PLATING CLASS 3 |
| P22 | Approved | 09/23/2008 | 09/23/2010 | 09/23/2010 | AMS/MIL-C-26074 ELECTROLESS NICKEL PLATING CLASS 4 |
| P23 | Approved | 09/23/2008 | 09/23/2010 | 09/23/2010 | MIL-G-45204 - GOLD ELECTROPLATING TYPE I, GRADE A |
| P24 | Approved | 09/23/2008 | 09/23/2010 | 09/23/2010 | MIL-G-45204 - GOLD ELECTROPLATING TYPE I, GRADE B |
| P25 | Approved | 09/23/2008 | 09/23/2010 | 09/23/2010 | MIL-G-45204 - GOLD ELECTROPLATING TYPE I, GRADE C |
| P26 | Approved | 09/23/2008 | 09/23/2010 | 09/23/2010 | MIL-G-45204 - GOLD ELECTROPLATING TYPE II, GRADE B |
| P27 | Approved | 09/23/2008 | 09/23/2010 | 09/23/2010 | MIL-G-45204 - GOLD ELECTROPLATING TYPE II, GRADE C |
| P28 | Approved | 09/23/2008 | 09/23/2010 | 09/23/2010 | MIL-G-45204 - GOLD ELECTROPLATING TYPE II, GRADE D |
| P29 | Approved | 09/23/2008 | 09/23/2010 | 09/23/2010 | MIL-G-45204 - GOLD ELECTROPLATING TYPE III, GRADE A |
| P48 | Approved | 09/23/2008 | 09/23/2010 | 09/23/2010 | QQ-N-290 - NICKEL ELECTROPLATING CLASS 1 |
| P49 | Approved | 09/23/2008 | 09/23/2010 | 09/23/2010 | QQ-N-290 - NICKEL ELECTROPLATING CLASS 2 |
| P58 | Approved | 09/23/2008 | 09/23/2010 | 09/23/2010 | MIL-T-10727 - TIN PLATING |
| Q60 | Approved | 10/14/2007 | 10/13/2010 | 10/13/2010 | AS9100 QMS - NO EXCLUSIONS |