| Cert Code | Cert Status | Survey Date | Review Date | Exp Date | Description |
|---|---|---|---|---|---|
| C17 | Approved | 01/03/2007 | 01/03/2010 | 01/03/2010 | AMS QQ-P-35/QQ-P-35 PASSIVATION OF STAINLESS STEEL |
| C1K | Approved | 01/04/2007 | 01/04/2010 | 01/04/2010 | ASTM A 967 CHEMICAL PASSIVATION FOR STAINLESS STEEL |
| C2P | Approved | 08/18/2009 | 08/17/2011 | 08/17/2011 | MIL-DTL-5541F ALUM CHEM FILM TYPE I,CLASS 1A |
| C2Q | Approved | 08/18/2009 | 08/17/2011 | 08/17/2011 | MIL-DTL-5541F ALUM CHEM FILM TYPE I,CLASS 3 |
| C2R | Approved | 08/18/2009 | 08/17/2011 | 08/17/2011 | MIL-DTL-5541F ALUM CHEM FILM TYPE II,CLASS 1A |
| C2S | Approved | 08/18/2009 | 08/17/2011 | 08/17/2011 | MIL-DTL-5541F ALUM CHEM FILM TYPE II,CLASS 3 |
| C65 | Approved | 01/03/2007 | 01/03/2010 | 01/03/2010 | AMS QQ-P-35/QQ-P-35 PASS OF STAINLESS ST TYPE II |
| C69 | Approved | 08/18/2009 | 08/17/2011 | 08/17/2011 | AMS/MIL-C-5541E ALUMINUM CHEMICAL FILM CLASS 1A |
| C70 | Approved | 08/18/2009 | 08/17/2011 | 08/17/2011 | AMS/MIL-C-5541E ALUMINUM CHEMICAL FILM CLASS 3 |
| P08 | Approved | 12/03/2008 | 12/03/2010 | 12/03/2010 | MIL-T-10727 TYPE I/ASTM B545 TIN ELECTROPLATING |
| P09 | Approved | 12/03/2008 | 12/03/2010 | 12/03/2010 | MIL-T-10727 - TYPE II - HOT DIP TIN COATING |
| P10 | Approved | 10/25/2007 | 10/18/2010 | 10/18/2010 | MIL-C-14550 - COPPER ELECTROPLATING |
| P12 | Approved | 02/27/2009 | 02/27/2011 | 02/27/2011 | AMS/MIL-P-81728 TIN ALLOY ELECTROPLATING |
| P1R | Approved | 10/25/2007 | 10/18/2010 | 10/18/2010 | SAE AMS 2418 COPPER PLATING TYPE 1 |
| P1S | Approved | 10/25/2007 | 10/18/2010 | 10/18/2010 | SAE AMS 2418 COPPER PLATING TYPE 2 |
| P1W | Approved | 10/25/2007 | 10/18/2010 | 10/18/2010 | MIL-G-45204 GOLD ELECTROPLATING TYPE II GRADE A |
| P23 | Approved | 10/25/2007 | 10/18/2010 | 10/18/2010 | MIL-G-45204 - GOLD ELECTROPLATING TYPE I, GRADE A |
| P24 | Approved | 10/25/2007 | 10/18/2010 | 10/18/2010 | MIL-G-45204 - GOLD ELECTROPLATING TYPE I, GRADE B |
| P25 | Approved | 10/25/2007 | 10/18/2010 | 10/18/2010 | MIL-G-45204 - GOLD ELECTROPLATING TYPE I, GRADE C |
| P26 | Approved | 10/25/2007 | 10/18/2010 | 10/18/2010 | MIL-G-45204 - GOLD ELECTROPLATING TYPE II, GRADE B |
| P27 | Approved | 10/25/2007 | 10/18/2010 | 10/18/2010 | MIL-G-45204 - GOLD ELECTROPLATING TYPE II, GRADE C |
| P28 | Approved | 10/25/2007 | 10/18/2010 | 10/18/2010 | MIL-G-45204 - GOLD ELECTROPLATING TYPE II, GRADE D |
| P29 | Approved | 10/25/2007 | 10/18/2010 | 10/18/2010 | MIL-G-45204 - GOLD ELECTROPLATING TYPE III, GRADE A |
| P48 | Approved | 10/25/2007 | 10/18/2010 | 10/18/2010 | QQ-N-290 - NICKEL ELECTROPLATING CLASS 1 |
| P49 | Approved | 10/25/2007 | 10/18/2010 | 10/18/2010 | QQ-N-290 - NICKEL ELECTROPLATING CLASS 2 |
| P58 | Approved | 12/03/2008 | 12/03/2010 | 12/03/2010 | MIL-T-10727 - TIN PLATING |
| P64 | Approved | 01/03/2007 | 01/03/2010 | 01/03/2010 | AMS 2433B - PLATING, NICKEL THALLIUM-BORON OR NICKEL BORON, ELECTROLESS DEPOSITED, TYPE 1 |