| Cert Code | Cert Status | Survey Date | Review Date | Exp Date | Description |
|---|---|---|---|---|---|
| E34 | Approved | 11/05/2009 | 11/05/2011 | 11/05/2011 | ASTM B700 ELECTRODEPOSITED COATINGS OF SILVER |
| P08 | Approved | 11/05/2009 | 11/05/2011 | 11/05/2011 | MIL-T-10727 TYPE I/ASTM B545 TIN ELECTROPLATING |
| P09 | Approved | 11/05/2009 | 11/05/2011 | 11/05/2011 | MIL-T-10727 - TYPE II - HOT DIP TIN COATING |
| P12 | Approved | 11/05/2009 | 11/05/2011 | 11/05/2011 | AMS/MIL-P-81728 TIN ALLOY ELECTROPLATING |
| P19 | Approved | 11/05/2009 | 11/05/2011 | 11/05/2011 | AMS/MIL-C-26074 ELECTROLESS NICKEL PLATING CLASS 1 |
| P1D | Approved | 11/05/2009 | 11/05/2011 | 11/05/2011 | ASTM B488 ELECTRODEPOSITED COATINGS OF GOLD, TYPE 1 |
| P1E | Approved | 11/05/2009 | 11/05/2011 | 11/05/2011 | ASTM B488 ELECTRODEPOSITED COATINGS OF GOLD, TYPE 2 |
| P1F | Approved | 11/05/2009 | 11/05/2011 | 11/05/2011 | ASTM B488 ELECTRODEPOSITED COATINGS OF GOLD, TYPE 3 |
| P1R | Approved | 11/05/2009 | 11/05/2011 | 11/05/2011 | SAE AMS 2418 COPPER PLATING TYPE 1 |
| P1S | Approved | 11/05/2009 | 11/05/2011 | 11/05/2011 | SAE AMS 2418 COPPER PLATING TYPE 2 |
| P1W | Approved | 11/05/2009 | 11/05/2011 | 11/05/2011 | MIL-G-45204 GOLD ELECTROPLATING TYPE II GRADE A |
| P20 | Approved | 11/05/2009 | 11/05/2011 | 11/05/2011 | AMS/MIL-C-26074 ELECTROLESS NICKEL PLATING CLASS 2 |
| P21 | Approved | 11/05/2009 | 11/05/2011 | 11/05/2011 | AMS/MIL-C-26074 ELECTROLESS NICKEL PLATING CLASS 3 |
| P22 | Approved | 11/05/2009 | 11/05/2011 | 11/05/2011 | AMS/MIL-C-26074 ELECTROLESS NICKEL PLATING CLASS 4 |
| P23 | Approved | 11/05/2009 | 11/05/2011 | 11/05/2011 | MIL-G-45204 - GOLD ELECTROPLATING TYPE I, GRADE A |
| P24 | Approved | 11/05/2009 | 11/05/2011 | 11/05/2011 | MIL-G-45204 - GOLD ELECTROPLATING TYPE I, GRADE B |
| P25 | Approved | 11/05/2009 | 11/05/2011 | 11/05/2011 | MIL-G-45204 - GOLD ELECTROPLATING TYPE I, GRADE C |
| P26 | Approved | 11/05/2009 | 11/05/2011 | 11/05/2011 | MIL-G-45204 - GOLD ELECTROPLATING TYPE II, GRADE B |
| P27 | Approved | 11/05/2009 | 11/05/2011 | 11/05/2011 | MIL-G-45204 - GOLD ELECTROPLATING TYPE II, GRADE C |
| P28 | Approved | 11/05/2009 | 11/05/2011 | 11/05/2011 | MIL-G-45204 - GOLD ELECTROPLATING TYPE II, GRADE D |
| P29 | Approved | 11/05/2009 | 11/05/2011 | 11/05/2011 | MIL-G-45204 - GOLD ELECTROPLATING TYPE III, GRADE A |
| P2C | Approved | 11/05/2009 | 11/05/2011 | 11/05/2011 | AMS 2404E ELECTROLESS NICKEL PLATING, CLASS 1 |
| P2D | Approved | 11/05/2009 | 11/05/2011 | 11/05/2011 | AMS 2404E ELECTROLESS NICKEL PLATING, CLASS 2 |
| P2E | Approved | 11/05/2009 | 11/05/2011 | 11/05/2011 | AMS 2404E ELECTROLESS NICKEL PLATING, CLASS 3 |
| P2F | Approved | 11/05/2009 | 11/05/2011 | 11/05/2011 | AMS 2404E ELECTROLESS NICKEL PLATING, CLASS 4 |
| P2K | Approved | 11/05/2009 | 11/05/2011 | 11/05/2011 | MIL-DTL-45204D : GOLD PLATING ELECTRODEPOSITED |
| P30 | Approved | 11/05/2009 | 11/05/2011 | 11/05/2011 | QQ-S-365 - SILVER ELECTROPLATING TYPE I, GRADE A |
| P31 | Approved | 11/05/2009 | 11/05/2011 | 11/05/2011 | QQ-S-365 - SILVER ELECTROPLATING TYPE I, GRADE B |
| P32 | Approved | 11/05/2009 | 11/05/2011 | 11/05/2011 | QQ-S-365 - SILVER ELECTROPLATING TYPE II, GRADE A |
| P33 | Approved | 11/05/2009 | 11/05/2011 | 11/05/2011 | QQ-S-365 - SILVER ELECTROPLATING TYPE II, GRADE B |
| P34 | Approved | 11/05/2009 | 11/05/2011 | 11/05/2011 | QQ-S-365 - SILVER ELECTROPLATING TYPE III, GRADE A |
| P35 | Approved | 11/05/2009 | 11/05/2011 | 11/05/2011 | QQ-S-365 - SILVER ELECTROPLATING TYPE III, GRADE B |
| P48 | Approved | 11/05/2009 | 11/05/2011 | 11/05/2011 | QQ-N-290 - NICKEL ELECTROPLATING CLASS 1 |
| P49 | Approved | 11/05/2009 | 11/05/2011 | 11/05/2011 | QQ-N-290 - NICKEL ELECTROPLATING CLASS 2 |
| P62 | Approved | 11/05/2009 | 11/05/2011 | 11/05/2011 | AMS 2404C - ELECTROLESS NICKEL-PLATING |
| P8F | Approved | 11/05/2009 | 11/05/2011 | 11/05/2011 | AMS 2424 NICKEL PLATE, LOW-STRESS DEPOSIT |